8.4
Élevée
Exploitée
CVE-2022-22071 Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Exploitation active constatée
· catalogue CISA KEV
Action attendue
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Campagnes de rançongiciel
Non constatée à ce jour
Faiblesse
CWE-416
Description
Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
Produits et versions touchés
| Produit | Versions touchées | Corrigé en |
|---|---|---|
| Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | Versions non publiées |
Références
- www.qualcomm.com www.qualcomm.com
Chronologie
- Publiée
- Ajoutée au catalogue KEV
- Dernière modification
Autres CVE de Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
Les 10 CVE de Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music →
CVE-2022-22080
Improper validation of backend id in PCM routing process can lead to memory corruption in Snapdragon Auto, Snapdragon…
8.4
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CVE-2021-35092
Processing DCB/AVB algorithm with an invalid queue index from IOCTL request could lead to arbitrary address modification…
6.7
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CVE-2021-35117
An Out of Bounds read may potentially occur while processing an IBSS beacon, in Snapdragon Auto, Snapdragon Compute,…
8.2
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CVE-2021-1970
Possible out of bound read due to lack of length check of FT sub-elements in Snapdragon Auto, Snapdragon Compute,…
7.5
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