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CVE-2021-30350 Lack of MBN header size verification against input buffer can lead to memory corruption in Snapdragon Auto, Snapdragon…
Description
Lack of MBN header size verification against input buffer can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables
Produits et versions touchés
| Produit | Versions touchées | Corrigé en |
|---|---|---|
| Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | Versions non publiées |
Références
- www.qualcomm.com www.qualcomm.com
Chronologie
- Publiée
- Dernière modification
Autres CVE de Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables
Les 12 CVE de Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables →
CVE-2021-30297
Possible out of bound read due to improper validation of packet length while handling data transfer in VR service in…
8.4
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CVE-2021-30292
Possible memory corruption due to lack of validation of client data used for memory allocation in Snapdragon Auto,…
8.4
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CVE-2021-30291
Possible memory corruption due to lack of validation of client data used for memory allocation in Snapdragon Auto,…
8.4
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CVE-2021-30258
Possible buffer overflow due to improper size calculation of payload received in VR service in Snapdragon Auto,…
8.4
Élevée