Non notée
CVE-2020-11239 Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned…
Description
Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Produits et versions touchés
| Produit | Versions touchées | Corrigé en |
|---|---|---|
| Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | Versions non publiées |
Autres CVE de Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Les 73 CVE de Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables →
CVE-2022-25682
Memory corruption in MODEM UIM due to usage of out of range pointer offset while decoding command from card in…
8.4
Élevée
CVE-2022-25724
Memory corruption in graphics due to buffer overflow while validating the user address in Snapdragon Auto, Snapdragon…
8.4
Élevée
CVE-2022-25743
Memory corruption in graphics due to use-after-free while importing graphics buffer in Snapdragon Auto, Snapdragon…
8.4
Élevée
CVE-2022-25687
memory corruption in video due to buffer overflow while parsing asf clips in Snapdragon Auto, Snapdragon Compute,…
7.3
Élevée