Non notée
CVE-2018-13888 There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array…
Description
There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605.
Produits et versions touchés
| Produit | Versions touchées | Corrigé en |
|---|---|---|
| Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | Versions non publiées |
Références
- 106475 www.securityfocus.com
- www.qualcomm.com www.qualcomm.com
Chronologie
- Publiée
- Dernière modification
Autres CVE de Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Les 6 CVE de Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables →
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Memory corruption in graphics support layer due to use after free condition in Snapdragon Auto, Snapdragon Consumer IOT,…
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Possibility of heap-buffer-overflow during last iteration of loop while populating image version information in diag…
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CVE-2018-13920
Use-after-free condition due to Improper handling of hrtimers when the PMU driver tries to access its events in…
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CVE-2018-13914
Lack of input validation for data received from user space can lead to an out of bound array issue in Snapdragon Auto,…
Non notée