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Vulnérabilités de qualcomm snapdragon_ar2_gen_1_platform_firmware

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CVE Résumé Score Publiée
CVE-2023-21660 Transient DOS in WLAN Firmware while parsing FT Information Elements 7.5 Élevée 6 juin 2023
CVE-2023-21658 Transient DOS in WLAN Firmware while processing the received beacon or probe response frame 7.5 Élevée 6 juin 2023
CVE-2022-40533 Transient DOS due to untrusted Pointer Dereference in core while sending USB QMI request 6.2 Moyenne 6 juin 2023
CVE-2022-33307 Memory Corruption due to double free in automotive when a bad HLOS address for one of the lists to be mapped is passed 8.4 Élevée 6 juin 2023
CVE-2022-33304 Transient DOS due to NULL pointer dereference in Modem while performing pullup for received TCP/UDP packet 7.5 Élevée 2 mai 2023
CVE-2022-33291 Information disclosure in Modem due to buffer over-read while receiving a IP header with malformed length 8.2 Élevée 4 avr. 2023
CVE-2022-33288 Memory corruption due to buffer copy without checking the size of input in Core while sending SCM command to get write… 9.3 Critique 4 avr. 2023
CVE-2022-33287 Information disclosure in Modem due to buffer over-read while getting length of Unfragmented headers in an IPv6 packet 8.2 Élevée 4 avr. 2023
CVE-2022-25739 Denial of service in modem due to missing null check while processing the ipv6 packet received during ECM call 7.5 Élevée 4 avr. 2023
CVE-2022-25726 Information disclosure in modem data due to array out of bound access while handling the incoming DNS response packet 8.2 Élevée 4 avr. 2023

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