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Vulnérabilités de qualcomm snapdragon_8_gen_1_mobile_platform_firmware

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CVE Résumé Score Publiée
CVE-2023-21660 Transient DOS in WLAN Firmware while parsing FT Information Elements 7.5 Élevée 6 juin 2023
CVE-2023-21658 Transient DOS in WLAN Firmware while processing the received beacon or probe response frame 7.5 Élevée 6 juin 2023
CVE-2022-40536 Transient DOS due to improper authentication in modem while receiving plain TLB OTA request message from network 7.5 Élevée 6 juin 2023
CVE-2022-40533 Transient DOS due to untrusted Pointer Dereference in core while sending USB QMI request 6.2 Moyenne 6 juin 2023
CVE-2022-33307 Memory Corruption due to double free in automotive when a bad HLOS address for one of the lists to be mapped is passed 8.4 Élevée 6 juin 2023
CVE-2022-33264 Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message 7.9 Élevée 6 juin 2023
CVE-2022-22060 Assertion occurs while processing Reconfiguration message due to improper validation 7.5 Élevée 6 juin 2023
CVE-2022-40508 Transient DOS due to reachable assertion in Modem while processing config related to cross carrier scheduling, which… 7.5 Élevée 2 mai 2023
CVE-2023-21630 Memory Corruption in Multimedia Framework due to integer overflow when synx bind is called along with synx signal 8.4 Élevée 4 avr. 2023
CVE-2022-33289 Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card 6.8 Moyenne 4 avr. 2023
CVE-2022-33288 Memory corruption due to buffer copy without checking the size of input in Core while sending SCM command to get write… 9.3 Critique 4 avr. 2023

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