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Vulnerabilities of qualcomm sg8275p_firmware

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CVE Summary Score Published
CVE-2023-43522 Transient DOS while key unwrapping process, when the given encrypted key is empty or NULL 7.5 High Feb 6, 2024
CVE-2023-33107 Exploited Qualcomm Multiple Chipsets Integer Overflow Vulnerability 8.4 High Dec 5, 2023
CVE-2023-33106 Exploited Qualcomm Multiple Chipsets Use of Out-of-Range Pointer Offset Vulnerability 8.4 High Dec 5, 2023
CVE-2023-33063 Exploited Qualcomm Multiple Chipsets Use-After-Free Vulnerability 7.8 High Dec 5, 2023
CVE-2023-33027 Transient DOS in WLAN Firmware while parsing rsn ies 7.5 High Oct 3, 2023
CVE-2023-33026 Transient DOS in WLAN Firmware while parsing a NAN management frame 7.5 High Oct 3, 2023
CVE-2023-24847 Transient DOS in Modem while allocating DSM items 7.5 High Oct 3, 2023

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